Flux-free solder bond "DBD3580S"
Fluxless solder die bonding (wire solder) for power semiconductors. Multi-chip mounting support available as an option!
Fluxless solder bonder for power semiconductors 'DBD3580S' Compatible with multi-row work such as Power QFN with a maximum width of 100mm. 【Specifications】 ■ Bonding process: wire solder application ■ Chip size: □1.0~6.0mm ~10.0mm (optional) ■ Bonding accuracy (XY): +/-50μm ■ Bonding accuracy (Θ): +/-3° ■ Bond/pick load: 30~200gf ■ Compatible work: lead frame or carrier ■ Maximum width supported: up to 100mm ■ Wafer size: 6 inches or 8 inches ■ Disco ring or expand ring ■ Machine cycle time: 0.60 seconds/chip, depending on various conditions ■ Pin transport ■ External dimensions: 2,000x1,235x1,650mm ■ Weight: 1,300kg ■ Main options: wafer changer (standard specification), magazine loader, wafer map, punch unit, etc. *For more details, please refer to the catalog or feel free to contact us.
- Company：テクサス
- Price：Other
